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CY62147EV30 MoBL
®
Document #: 38-05440 Rev. *G Page 4 of 13
Thermal Resistance
[9]
Parameter Description Test Conditions
VFBGA
Package
TSOP II
Package
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch, two-layer
printed circuit board
75 77 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
10 13 °C/W
Figure 4. AC Test Load and Waveforms
Parameters 2.50V 3.0V Unit
R1 16667 1103 Ω
R2 15385 1554 Ω
R
TH
8000 645 Ω
V
TH
1.20 1.75 V
Data Retention Characteristics
Over the Operating Range
Parameter Description Conditions Min Typ
[2]
Max Unit
V
DR
V
CC
for Data Retention 1.5 V
I
CCDR
[8]
Data Retention Current V
CC
= 1.5V, CE > V
CC
– 0.2V,
V
IN
> V
CC
– 0.2V or V
IN
< 0.2V
Ind’l/Auto-A 0.8 7 μA
Auto-E 12
t
CDR
[9]
Chip Deselect to Data Retention Time 0 ns
t
R
[10]
Operation Recovery Time t
RC
ns
Figure 5. Data Retention Waveform
[
1
, 11]
V
CC
V
CC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns
Fall Time = 1 V/ns
OUTPUT V
ALL INPUT PULSES
R
TH
R1
Equivalent to: THEVENIN EQUIVALENT
V
CC(min)
V
CC(min)
t
CDR
V
DR
> 1.5V
DATA RETENTION MODE
t
R
V
CC
CE or
BHE
.BLE
Notes
10.Full device operation requires linear V
CC
ramp from V
DR
to V
CC(min)
> 100 μs or stable at V
CC(min)
> 100 μs.
11. BHE
.BLE is the AND of both BHE and BLE. Deselect the chip by either disabling the chip enable signals or by disabling both BHE and BLE.
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