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CY62157EV18 MoBL
®
Document #: 38-05490 Rev. *D Page 4 of 12
Thermal Resistance
[8]
Parameter Description Test Conditions BGA Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
72 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
8.86 °C/W
AC Test Loads and Waveforms
Parameters Value Unit
R1 13500 Ω
R2 10800 Ω
R
TH
6000 Ω
V
TH
0.80 V
Data Retention Characteristics (Over the Operating Range)
Parameter Description Conditions Min
Typ
[2]
Max Unit
V
DR
V
CC
for Data Retention 1.0 V
I
CCDR
Data Retention Current V
CC
= V
DR
, CE
1
> V
CC
– 0.2V,
CE
2
< 0.2V,V
IN
> V
CC
– 0.2V or V
IN
< 0.2V
13µA
t
CDR
[8]
Chip Deselect to Data Retention Time 0 ns
t
R
[9]
Operation Recovery Time t
RC
ns
Data Retention Waveform
[10]
3V
V
CC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns
Fall Time = 1 V/ns
OUTPUT V
Equivalent to: THEVENIN EQUIVALENT
ALL INPUT PULSES
R
TH
R1
V
CC(min)
t
CDR
V
DR
>
1.0V
DATA RETENTION MODE
t
R
V
CC(min)
CE
1
or
V
CC
BHE.BLE
CE
2
or
Notes
9. Full device operation requires linear V
CC
ramp from V
DR
to V
CC(min)
> 100 µs or stable at V
CC(min)
> 100 µs.
10.BHE
.BLE is the AND of both BHE and BLE. Deselect the chip by either disabling chip enable signals or by disabling both BHE and BLE.
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