A SERVICE OF

logo

CY8C24123A
CY8C24223A, CY8C24423A
Document Number: 38-12028 Rev. *I Page 49 of 56
Figure 30. 28-Pin (300-Mil) Molded SOIC
Figure 31. 32-Pin (5x5 mm) QFN
51-85026 *D
32
X = 138 MIL
Y = 138 MIL
AD X, Y for this product is 3.53 mm, 3.53 mm (+/-0.11 mm)
TOP VIEW
C
N
BOTTOM VIEW
SEATING
PLANE
N
2
2
1
1
0°-12°
PIN1 ID
SIDE VIEW
0.20 R.
Ø
3.50
0.45
3.503.50
-0.20
3.50
0.50
0.42±0.18
[4X]
1. HATCH AREA IS SOLDERABLE EXPOSED PAD.
2. REFERENCE JEDEC#: MO-220
4. ALL DIMENSIONS ARE IN MM [MIN/MAX]
NOTES
:
32LD QFN 5 X 5mm PACKAGE OUTLINE
01/29/07
PART #
PB-FREE
STANDARD
LY32
5. PACKAGE CODE
51-85188SEE NOTES
*B
CMG
UNLESS OTHERWISE SPECIFIED
ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]
MATERIAL
STANDARD TOLERANCES ON:
DECIMALS
.XXX
.XXXX
.XX
-
+
-
+
+
-
COMPANY CONFIDENTIAL
DESIGNED BY
APPROVED BY
APPROVED BY
DRAWN
ANGLES
-
+
CHK BY
DATE
DATE
DATE
DATE
DATE
CYPRESS
TITLE
SIZE
PART NO. DWG NO REV
11/01/06
DESCRIPTION
3. PACKAGE WEIGHT: 0.054g
JSO
LF32
PAD
EXPOSED
SOLDERABLE
(SUBCON PUNCH TYPE PKG with 3.50 X 3.50 EPAD)
CHANGED SPEC. TITLE, CORRECTED EPAD DIMENSION
51-85188 *B
[+] Feedback