Contents 3
Contents
Component identification ............................................................................................................... 6
Front panel components ............................................................................................................................. 6
Front panel LEDs ....................................................................................................................................... 7
SAS and SATA hard drive LEDs ................................................................................................................... 8
SAS and SATA hard drive LED combinations ................................................................................................ 8
System board components .......................................................................................................................... 9
Mezzanine connector definitions ..................................................................................................... 10
DIMM slot locations ....................................................................................................................... 10
System maintenance switch ............................................................................................................. 10
HP c-Class Blade SUV Cable..................................................................................................................... 11
Operations ................................................................................................................................. 12
Power up the server blade ........................................................................................................................ 12
Power down the server blade .................................................................................................................... 12
Remove the server blade .......................................................................................................................... 13
Remove the access panel.......................................................................................................................... 14
Install the access panel............................................................................................................................. 14
Remove the DIMM baffle .......................................................................................................................... 14
Setup ......................................................................................................................................... 15
Overview ............................................................................................................................................... 15
Installing an HP BladeSystem c-Class enclosure ........................................................................................... 15
Installing server blade options ................................................................................................................... 15
Installing interconnect modules .................................................................................................................. 15
Interconnect bay numbering and device mapping .............................................................................. 16
Connecting to the network ........................................................................................................................ 18
Installing a server blade ........................................................................................................................... 18
Hardware options installation ....................................................................................................... 21
Introduction ............................................................................................................................................ 21
Hard drive option .................................................................................................................................... 21
Processor option ...................................................................................................................................... 22
Memory options ...................................................................................................................................... 27
Memory subsystem architecture ....................................................................................................... 28
Single-, dual-, and quad-rank DIMMs ............................................................................................... 28
Low voltage DIMMs ....................................................................................................................... 28
DIMM identification ....................................................................................................................... 29
Memory configurations ................................................................................................................... 30
General DIMM slot population guidelines ......................................................................................... 31
Installing a DIMM .......................................................................................................................... 34
Mezzanine card option ............................................................................................................................ 35
Cache module and battery pack option ...................................................................................................... 36
HP Trusted Platform Module option ............................................................................................................ 40
Installing the Trusted Platform Module board ..................................................................................... 41
Retaining the recovery key/password .............................................................................................. 44
Enabling the Trusted Platform Module ............................................................................................... 44
Cabling ..................................................................................................................................... 46
