User’s Manual
ECM-5510 User’s Manual
19
1.6.5 Winbond W83627HF-AW LPC Super I/O
The Winbond W83627F/HF is made to fully comply with Microsoft PC98 and PC99
Hardware Design Guide. Moreover, W83627F/HF is made to meet the specification of
PC98/PC99’s requirement in the power management: ACPI and DPM (Device Power
Management). Super I/O chip provides features as the following:
• Meet LPC Spec. 1.0
• Support LDRQ# (LPC DMA), SERIRQ (serial IRQ)
• Include all features of Winbond I/O W83977TF and W83977EF
• Integrate Hardware Monitor functions
• Compliant with Microsoft PC98/PC99 Hardware Design Guide.
• Support DPM (Device Power Management), ACPI
• Programmable configuration settings
• Single 24 or 48 MHz clock input
1.6.6 Winbond W83977EF ISA Super I/O
The Winbond W83627F/HF is made to fully comply with Microsoft PC98 Hardware Design
Guide. Moreover, W83627F/HF is made to meet the specification of PC98’s requirement in
the power management: ACPI and DPM (Device Power Management). Super I/O chip
provides features as the following:
• Plug & Play 1.0A compatible
• Supports 12 IRQs, 4 DMA channels, full 16-bit address decoding
• Capable of ISA Bus IRQ Sharing
• Compliant with Microsoft PC98 Hardware Design Guide
• Supports DPM (Device Power Management), ACPI
• Reports ACPI status interrupt by SCI# signal issued from any of the 12 IRQs pins or
GPIO xx
• Programmable configuration settings
• Single 24/48 Mhz clock input
