Related Documentation from Texas Instruments
www.ti.com
3.2 Fault Reporting
The OTW and SD outputs from TAS5611/13 indicate fault conditions. See the
TAS5611PHD/TAS5613PHD data manual for a description of these pins.
Table 3. TAS5611/13 Warning/Error Signal Decoding
SD OTW1 OTW2 Device Condition
0 0 0 High-temperature error and/or high-current error
0 0 1 Undervoltage lockout or high current error. 100°C
temperature warning.
0 1 1 Undervoltage lockout or high-current error
1 0 0 125°C temperature warning
1 0 1 100°C temperature warning
1 1 1 Normal operation, no errors/warnings
The shutdown signals together with the temperature warning signal give chip-state information as
described in the Table 3. device fault-reporting outputs are open-drain outputs.
4 Related Documentation from Texas Instruments
Table 4 contains a list of data manuals that have detailed descriptions of the integrated circuits used in the
design of the TAS5611/13PHD2EVM. The data manuals can be obtained at the URL http://www.ti.com.
Table 4. Related Documentation from
Texas Instruments
Part Number Literature Number
TAS5611 SLAS681
TAS5613 SLAS676
OPA1632D SBOS286
LM317M SLVS297
TL2575HV-15I SLVS638
4.1 Additional Documentation
1. System Design Considerations for True Digital Audio Power Amplifiers application report (SLAA117)
2. Digital Audio Measurements application report (SLAA114)
3. PSRR for PurePath Digital™ Audio Amplifiers application report (SLEA049)
4. Power Rating in Audio Amplifiers application report (SLEA047)
5. PurePath Digital™ AM Interference Avoidance application report (SLEA040)
6. Click and Pop Measurements Technique application report (SLEA044)
7. Power Supply Recommendations for DVD-Receivers application report (SLEA027)
8. Implementation of Power Supply Volume Control application report (SLEA038)
Appendix A Design Documents
This appendix comprises design documents pertaining to the TAS5611/13PHD2EVM evaluation module.
The documents are presented in the following order.
• Schematic (4 pages)
• Parts List (1 pages)
• PCB Specification (1 page)
• PCB Layers (6 pages)
• Heat-Sink Drawing (1 page)
• Inductor (1 page)
8
Design Documents SLOU286–December 2009
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