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HUAWEI MG323 GSM M2M Module
Hardware Guide
Electrical and Reliability Features
Issue 04 (2011-08-22)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
39
5.6 Reliability Features
Table 5-7 lists the test conditions and results of the mechanical reliability of the
MG323 module.
Table 5-7 Test conditions and results of the mechanical reliability of the MG323 module
Item
Test Condition
Standard
Low-temperature
storage
Temperature: –40 ºC ± 2ºC
Test duration: 24 h
IEC60068
High-temperature
storage
Temperature: 85 ºC ± 2ºC
Test duration: 24 h
IEC60068
Low-temperature
working
Temperature: –30 ºC ± 2ºC
Test duration: 24 h
IEC60068
High-temperature
working
Temperature: 75 ºC ± 2ºC
Test duration: 24 h
IEC60068
Damp heat cycling
High temperature: 55 ºC ± 2ºC
Low temperature: 25 ºC ± 2ºC
Humidity: 95%
Repetition times: 4
Test duration: 12 h + 12 h
IEC60068
Temperature shock
Low temperature: –40 ºC ± 2ºC
High temperature: 85 ºC ± 2ºC
Temperature change interval: < 30s
Test duration: 15 min
Repetition times: 100
IEC60068
Condensation test
Temperature: –40 ºC ± 2°C
Time for keeping condensed: 2 h
Recovery temperature: 25 ºC ± 2°C
Recovery time: 5 min
Repetition times: 6
IEC60068
Dust test
Dust density: 2 kg/m
3
Dust type: dry talcum powder
Size requirement: < 75 µm
Duration: 8 h
IEC60068
Salty fog test
Temperature: 35°C
Density of the NaCl solution: 5±1%
Spraying interval: 8 h
Duration of exposing the module to
the temperature of 35°C: 16 h
IEC60068