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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3.3.5 Audio Signal Processing & Interface
Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal
from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (QSC6270). This
transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset. The downlink
path amplifies the signal from DBB chip (QSC6270) and outputs it to receiver (or speaker).
The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The outputs
earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_OP, LINE_ON) are differential outputs. Earphone2 (HPH_L,
HPH_R) is a single-ended output stage designed to drive a headset speaker. The microphone interface consists
of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.